Suspended ceiling, a ceiling tile and an associated installation method

ABSTRACT

In accordance with the present inventive concept, there is provided a suspended ceiling comprising a ceiling tile ( 500 ) and a grid of profiles forming a frame which supports the ceiling tile ( 500 ). The ceiling tile ( 500 ) has a first and a second pair of non-adjacent side-edge portions, wherein the grid of profiles engages from below with the first pair of side-edge portions, and wherein the grid of profiles engages from above with the second pair of side-edge portions. The grid of profiles engages with said first and second pair of side-edge portions such that a clamping action that counteracts lateral displacement of the ceiling tile ( 500 ) is provided. There is also provided a method for mounting the suspended ceiling. Furthermore, the present inventive concept also relates to an improved ceiling tile ( 500 ) for a suspended ceiling.

FIELD OF THE INVENTION

The present invention relates to a suspended ceiling. More specifically,the present invention relates to an improved suspended ceilingcomprising a ceiling tile and supporting structure and a method forinstalling the ceiling tile in the supporting structure. The presentinvention also relates to an improved ceiling tile for a suspendedceiling.

BACKGROUND ART

A suspended ceiling in a room or in another accommodation may serve avariety of purposes. One purpose of having a suspended ceiling may be toconceal an underside of a space, such as another room, which is locatedabove the room. Another purpose may be to provide an improved noiseabsorption and/or noise attenuation in and outside of the room. Theresulting plenum space located between the suspended ceiling and a mainceiling of the room may further be utilized to accommodate e.g. wiring,piping, as well as devices related to heating, ventilation and aircondition.

Typically, the suspended ceiling consists of a plurality of ceilingpanels which are fitted into a supporting grid, comprising invertedT-profiles, which is mounted in the main ceiling. In the disclosureEP0979908, there is provided ceiling panels which may conceal thesupporting grid when viewed from below. More specifically, according toEP0979908, each ceiling panel is provided with horizontal kerfs alongtwo opposing edges which thereby allow two adjacent ceiling panels tocome closer to each other while concealing the supporting grid.

However, known ceiling panels are easily displaced from their fittingsin the supporting grid. In one example, a displacement of a ceilingpanel may be induced by a sudden change of air pressure in the room, forinstance when a door connected to the room is abruptly opened or closed.In another example, the displacement may occur when a force is appliedto the ceiling panel from below, which may happen, for example, during acleaning process of the ceiling panel. The displacement problem has beenaddressed in the disclosure EP0979908, wherein certain springarrangements have been used. Alternatively, so-called hold-down clipsmounted on the back sides of the ceiling panels may be utilized tospring arrangements or hold-down clips, are concealed in an assembledstate. However, it is typically cumbersome and time consuming to installthese external locking devices into each, often large number, of theceiling tiles to be mounted. Moreover, the external locking devices maydestroy parts keep the ceiling panels in place. Preferably, theseexternal locking devices, such as spring arrangements or hold-downclips, are concealed in an assembled state. However, it is typicallycumbersome and time consuming to install these external locking devicesinto each, often large number, of the ceiling tiles to be mounted.Moreover, the external locking devices may destroy parts of the ceilingtile, due to the ceiling tile being porous and consequently fragile.Also, it is difficult to implement an efficient automated manufacturingprocess in which the external locking device is mounted into a properposition of the ceiling tile.

U.S. Pat. No. 2,318,092 and NL 1011196 each discloses a suspendedceiling comprising rectangular ceiling tiles supported by a grid ofprofiles forming frames engaging the tiles on all four sides.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide animproved suspended ceiling comprising a ceiling tile which in a mountedstate is more efficiently prevented from involuntary displacements.Moreover, it is an object to provide a method for mounting the improvedsuspended ceiling.

A further object of the present invention is to provide an improvedceiling tile which is adapted to be mounted in the inventive suspendedceiling according to the above.

According to a first aspect of the invention, there is provided asuspended ceiling comprising a ceiling tile and a grid of profilesforming a frame which supports the ceiling tile. The ceiling tile has afirst and a second pair of non-adjacent side-edge portions, wherein thegrid of profiles engage from below with the first pair of side-edgeportions, and wherein the grid of profiles engage from above with thesecond pair of side-edge portions. The grid of profiles engages withsaid first and second pair of side-edge portions such that a clampingaction that counteracts lateral displacement of the ceiling tile isprovided.

An advantage of the present inventive concept is that the ceiling tileis prevented from getting displaced in a vertical direction. By means ofthe engagement from above as well as from below, a vertical displacementof the ceiling tile is prevented. A portion of the grid of profiles mayengage from below with the first pair of side-edge portions of theceiling tile while another portion of the grid of profiles may engagefrom above with the second side-edge portions of the ceiling tile. Aside-edge portion of the ceiling tile may be a part of an underside ofthe ceiling tile, a part of an upper side of the ceiling tile, a grooveor cavity provided in a side portion of the ceiling tile, a protrusionprovided in a side portion of the ceiling tile, etc. Moreover, there isno need for any external locking devices, such as spring arrangements orhold-down clips, in order to further secure the ceiling tile.

A further advantage of the present inventive concept is that the ceilingtile is easy to mount. More specifically, the ceiling tile may bemounted by performing a series of acts which are described below inrelation to the second aspect of the invention.

A further advantage of the present inventive concept is that it isunnecessary to lift the ceiling tile above the grid of profiles duringmounting, thereby making the mounting process easier. Thereby, a smallervertical extension of the plenum space may be needed in order to mountthe ceiling tile which, for instance, may result in more availableheadroom in the room.

Another advantage of the present invention is that the ceiling tile alsois easily demountable. For example, this property may make it easier toaccess the plenum space when needed. In particular, there is no need fora separate entrance chamber in the ceiling for accessing the plenumspace, since any part of the suspended ceiling comprising the inventiveceiling tiles is equally accessible.

Thus, in a mounted state the ceiling tiles comprised in the inventivesuspended ceiling are more efficiently prevented from involuntarydisplacements which may be induced by a wind uplift, impacts fromobjects, forces applied to the ceiling panel from below, e.g. during acleaning process, a sudden change of air pressure in the room when adoor connected to the room is abruptly opened, etc.

By means of the clamping action, or frictional fit, the ceiling tile iskept fixed in a lateral position, being restrained by friction.Preferably, the clamping action is such that the ceiling tile is keptfixed at least in a first lateral direction. More preferably, theclamping action is such that the ceiling tile is kept fixed in twoperpendicular lateral directions.

According to one embodiment, the grid of profiles engages with the firstand second pair of side-edge portions under elastical deformation of thelatter. By an elastical deformation of an object with a given originalshape, which is not deformed, is meant a moderate deformation or bendingof the object such that it essentially assumes its original undeformedshape when the deformation action or bending is ceased. An advantage ofthis embodiment is that the ceiling tile may be more easily mounted,since it may be bent, to a larger or lesser extent, into position.Another advantage of this embodiment is that a mounted ceiling tile maybe demounted and then mounted again without appreciably destroying theceiling tile.

According to an alternative embodiment, the grid of profiles engageswith the first and second pair of side-edge portions under inelasticaldeformation of the latter. After the inelastical deformation, theceiling tile does not assume its original undeformed shape. After ademounting of this ceiling tile, it may be replaced by another ceilingtile. Optionally, parts of the ceiling tile may be reused.

Optionally, the grid of profiles may engage with the first and secondpair of side-edge portions under elastical deformation of the grid ofprofiles, or more specifically, elastical deformation of flangesprovided in the profiles. As a further option, the grid of profiles mayengage with the first and second pair of side-edge portions underelastical deformation of the grid of profiles as well as under elasticdeformation of the first and second pair of side-edge portions theceiling tile.

According to one embodiment, the first pair of side-edge portionscomprises a first side edge and a second side edge, wherein a firstgroove is provided in and extending along the first side edge, andwherein a second groove is provided in and extending along the secondside edge. A depth of the first groove is larger than a depth of thesecond groove and, moreover, the grid of profiles comprises a first anda second flange which are received by the first and second grooves,respectively. Thus, the grid of profiles may engage from below with atleast a portion of the first and second grooves. An advantage ofproviding the ceiling tile with grooves is that the positioning of theceiling tile is further improved, at least in one lateral direction.Optionally, a portion of the grid of profiles may also engage from abovewith at least a portion of the first or second groove.

By means of the first groove having a larger depth than the secondgroove, the flanges may more easily be inserted into the respectivegroove allowing for a simpler mounting. In particular, an installationof the ceiling tile from below the suspended ceiling is admitted. As aconsequence, a smaller plenum space may be needed for installing theceiling tile which may result in, for instance, more headroom in theroom. Another advantage of providing the ceiling tile with grooves isthat the ceiling tile may be inserted into a part of the grid ofprofiles and may thereby conceal at least part of the grid of profiles.

According to one embodiment, the engagement between the grid of profilesand the first pair of side-edge portions occurs between the first andsecond flange and an upper engagement surface associated with the firstand second groove, respectively. The engagement may occur at arespective upper portion of the first and second flanges. The upperengagement surface of each groove may be a portion of an area formed bythe groove. For example, the first groove may give rise to twooppositely arranged walls; the upper engagement surface of the firstgroove may be one of these walls. Analogous remarks holds for the secondgroove.

The surface profile of the upper engagement surface may be flat,stepwise flat, stepwise curved, etc.

According to one embodiment, the upper engagement surface of the firstgroove is stepped. The step may be such that a width of the groove issmaller at a large depth of the groove than a width at a small depth ofthe same. Moreover, the step may be such that a lateral displacement maybe prevented.

By means of the step in the groove, there is provided a first and asecond depth in the first groove: the first depth may substantiallycorrespond to the depth of the second groove while the second depth maybe larger than the depth of the second groove. The grid of profiles mayengage with the second depth of the groove when installing the ceilingtile and with the second depth of the groove when the ceiling tile ismounted and aligned in a proper position. Thus, an advantage of havingthe step is that, when displacing the ceiling tile engaging with thegrid of profiles by means of a first upper engagement surface towardsthe second flange, the ceiling tile may after a given distance clicksdown so that it engages with the grid of profiles by means of a secondupper engagement surface of the step. As a result of the ceiling tileclicking down, whereby e.g. the ceiling tile clicks into a properposition, a worker mounting the ceiling tile may obtain a confirmationthat the ceiling tile is located in or close to a proper position.

A further advantage is that a lateral displacement of the ceiling tilemay be prevented, in spite of there being a deeper portion of the firstgroove. In order to displace the ceiling tile from its mountingposition, a very specific combination of vertical and horizontal forcesat various suitable locations at a front surface of the ceiling tileneeds to be applied.

According to an alternative embodiment, also an upper engagement surfaceof the second groove is stepped. The depth of the second groove may beequal to a depth of the first groove.

Optionally, there may be several steps provided in the upper engagementsurface of the first groove. The width of the groove may be stepwiseconstant.

Optionally, a portion of the stepped profiles which is arranged toengage with the grid of profiles may comprise a material having largerfriction against the grid of profiles than other portions of the ceilingtile.

According to one embodiment, the second pair of side-edge portionscomprises a third side edge and a fourth side edge, wherein a firststepped profile is provided in and extending along the third side edgefor forming a step in a back surface of the ceiling tile, and wherein asecond stepped profile is provided in and extending along the fourthside edge for forming a step in the back surface. Moreover, the grid ofprofiles comprises a third and a fourth flange received by the first andsecond stepped profiles, respectively. By means of this embodiment, afirst pair of profiles comprised in the grid of profiles may engage frombelow with the first and second grooves, while a second pair of profilesmay engage from above with the stepped profiles provided in the ceilingtile, the first and second pair of profiles being situated at the sameheight. A further advantage of providing the ceiling tile with steppedprofiles is that the positioning of the ceiling tile is furtherimproved, at least in one lateral direction. Together with the groovesaccording to the embodiment above, the positioning of the ceiling tileis improved in two lateral directions.

According to one embodiment, the engagement between the grid of profilesand the second pair of side-edge portions occurs between the third andfourth flange and a lower engagement surface associated with the firstand second stepped profile, respectively. Preferably, each lowerengagement surface has a surface profile with substantially correspondsto a surface profile of an associated area of the flange in which theengagement occurs. For example, the surface profile of the lowerengagement surface may be flat, stepwise flat, stepwise curved, etc.

According to one embodiment, the grid of profiles comprises a pluralityof inverted T-profiles. The first and second flange may be provided ontwo separate inverted T-profiles. The grid of profiles may comprise ametallic material, such as steel or a sheet metal. Alternatively, thegrid of profiles may comprise a light-weight material, for example alight metal such as aluminum.

According to an alternative embodiment, the grid of profiles maycomprise at least one of an L-profile, an H-profile, an I-profile and aZ-profile.

According to one embodiment, the ceiling tile is rectangular. In oneexample, the ceiling tile is quadratic, each side edge having equalextensions. With regard to the rectangular ceiling tile, the first pairof non-adjacent side-edge portions comprises two opposing side edgeshaving a first extension and the second pair of non-adjacent side-edgeportions comprises the other two opposing side edges of the rectanglehaving a second extension. According to one embodiment, the ceiling tilecomprises an elastically deformable material. According to anotherembodiment, the ceiling tile comprises compressed fibre material. Thecompressed fibre material may be mineral wool such as rock wool or,especially, glass wool.

According to one embodiment, the suspended ceiling further comprises aplurality of ceiling tiles of the type according to any of theembodiments described in the above. The plurality of ceiling tiles mayhave varying dimensions. For example, a ceiling tile adjacent to acorner or a wall may be smaller than a ceiling tile which is not.

According to a second aspect of the invention there is provided a methodfor mounting a suspended ceiling. The method comprises the acts ofproviding a grid of profiles, and a ceiling tile, and installing theceiling tile in a frame of said grid of profiles, wherein the ceilingtile has a first and a second pair of non-adjacent side-edge portions.The act of installing the ceiling tile comprises: arranging the ceilingtile in an inclined position and directing a first side edge of thefirst pair of side-edge portions towards a first flange of the frame;inserting, by relative displacement of the ceiling tile and the grid ofprofiles, the first flange into a first groove of the ceiling tileprovided along the first side edge to such an extent that a second sideedge of the first pair of side-edge portions clears a second flange ofthe frame, whereby the first flange engages from below with an upperengagement surface associated with the first groove; arranging theceiling tile in an horizontal position and aligning a second groove ofthe ceiling tile provided along the second side edge with the secondflange, such that a third and a fourth flange of the frame engage fromabove with a third and a fourth side edge, respectively, of the secondpair of side-edge portions, the first flange continuing to engage frombelow with the upper engagement surface associated with the firstgroove; displacing the ceiling tile towards the second flange, thefirst, third and fourth flange continuing to engage with the first,third and fourth side edge, respectively, such that the second flangeengage from below with an upper engagement surface associated with thesecond groove, whereby said flanges engages with said side-edge portionssuch that a clamping action that counteracts lateral displacement of theceiling tile is provided.

According to one embodiment, the act of providing a ceiling tile furthercomprises providing a ceiling tile in which said upper engagementsurface of said first groove is stepped.

According to one embodiment, a first stepped profile is provided in andextending along the third side edge for forming a step in a back surfaceof the ceiling tile, and a second stepped profile is provided in andextending along the fourth side edge for forming a step in the backsurface. Moreover, the third and fourth flanges comprised in the grid ofprofiles engage with the first and second stepped profiles,respectively.

According to one embodiment, the grid of profiles engages with the firstand second pair of side-edge portions under elastical deformation of thelatter.

The details and advantages of the second aspect of the invention arelargely analogous to those of the first aspect of the invention, whereinreference is made to the above. In addition, it is noted that theceiling tile may be mounted in a preassembled grid of profiles.

According to a third aspect of the invention there is provided a ceilingtile for a suspended ceiling. The ceiling tile is arranged to besupported by flanges of a grid of profiles, where the flanges have athickness T. The ceiling tile has a front surface, a back surface and afirst and a second pair of non-adjacent side-edge portions, wherein eachside-edge portion of the first pair comprises an upper engagementsurface faced in the same direction as the front surface and eachside-edge portion of the second pair comprises a lower engagementsurface faced in the same direction as the back surface. Moreover, theupper engagement surfaces are arranged at a distance (X) from the frontsurface, and the lower engagement surfaces are arranged at a distance(Y) from the front surface, wherein the difference between the distanceX and the distance Y is less than the thickness T.

The ceiling tile may be mounted in a suspended ceiling comprising asupporting structure in the form of a grid of profiles. The upper andlower engagement surfaces may engage with the flanges. This engagementmay occur by means of a clamping action that counteracts lateraldisplacement of the ceiling tile. The engagement may also occur underelastical deformation of the first and second pair of side-edgeportions.

As is clear from the above, in an unmounted state of the ceiling tile,the difference between the distance X and the distance Y is less thanthe thickness T. In equations, this relation may be written as X−Y<T. Bymeans of the relation between X, Y and T, a clamping action is obtained,thereby keeping the ceiling tile in place. In a non-limiting example,X=15 mm, Y=14 mm and T=1.1 mm, so that the difference becomes X−Y=1 mm,which is smaller than 1.1 mm. In a mounted state, however, when theceiling tile is mounted in a grid of profiles, at least one of the lowerengagement surfaces may be compressed and the relation above between Xand Y may be modified. Moreover, at least one of the upper engagementsurfaces may be compressed. For instance, in a mounted state, therelation X′−Y′=T may hold, where X′ and Y′ are the distancescorresponding to X and Y when the ceiling tile is mounted.

According to one embodiment, the first pair of side-edge portionscomprises a first side edge and a second side edge, wherein a firstgroove is provided in and extending along the first side edge andwherein a second groove is provided in and extending along the secondside edge. The first and the second groove may be provided between thefront surface and the back surface. A depth of the first groove may belarger than a depth of the second groove. Moreover, the upper engagementsurfaces comprised in the first pair of side-edge portions may bearranged in the first and second groove. According to one embodiment,the upper engagement surface of the first groove is stepped. The stepmay be such that a width of the groove is smaller at a large depth ofthe groove than a width at a small depth of the same. Moreover, the stepmay be such that a lateral displacement may be prevented.

According to one embodiment, the second pair of side-edge portionscomprises a third side edge and a fourth side edge, wherein a firststepped profile is provided in and extending along the third side edgefor forming a step in a back surface of the ceiling tile, and wherein asecond stepped profile is provided in and extending along the fourthside edge for forming a step in the back surface. The lower engagementsurfaces may be arranged in the third and fourth stepped profiles.

According to one embodiment, the ceiling tile is rectangular. In oneexample, the ceiling tile is quadratic, each side edge having equalextensions. According to one embodiment, the ceiling tile comprises anelastically deformable material. According to another embodiment, theceiling tile comprises compressed fibre material. The compressed fibrematerial may be mineral wool such as rock wool or, especially, glasswool.

According to one embodiment, at least one of the lower or upperengagement surfaces has an undulating or irregular shape, the engagementsurfaces thereby being arranged at a varying distance from the frontsurface. For instance, the undulating or irregular shape may be waveshaped, saw-tooth shaped, etc. An advantage of having an undulating orirregularly shaped engagement surface is that the ceiling tile may bemore easily compressed in these areas and may thereby engage with thegrid of profiles more easily. Simultaneously, however, the magnitude ofthe engagement between the engagement surfaces and the grid of profilesmay be reduced.

When the distance between an engagement surface and the front surface isvarying, the distance may have a maximal magnitude and a minimalmagnitude. The distance may be measured normal to the front surface.Thus, the concept of distance may be defined as follows. In one example,the distance between the engagement surface and the front surface isdefined to be the maximal magnitude of the distance. In another example,the distance between the engagement surface and the front surface isdefined to be the minimal magnitude of the distance. In yet anotherexample, the distance between the engagement surface and the frontsurface is defined to be an average distance between the front surfaceand the engagement surface which is arranged at a varying distance fromthe front surface.

The profiles comprised in the grid of profiles may have any shape andcross sections. In one example, the profiles comprise invertedT-profiles. Moreover, the grid of profiles may comprise flanges whichare situated at different heights.

Other details and advantages of the third aspect of the invention arelargely analogous to those of the first aspect of the invention, whereinreference is made to the above.

Generally, all terms used in the claims are to be interpreted accordingto their ordinary meaning in the technical field, unless explicitlydefined otherwise herein. All references to “a/an/the [element, device,component, means, step, etc]” are to be interpreted openly as referringto at least one instance of said element, device, component, means,step, etc., unless explicitly stated otherwise. The steps of any methoddisclosed herein do not have to be performed in the exact orderdisclosed, unless explicitly stated.

BRIEF DESCRIPTION OF THE DRAWINGS

The above, as well as additional objects, features and advantages of thepresent invention, will be better understood through the followingillustrative and non-limiting detailed description of preferredembodiments of the present invention, with reference to the appendeddrawings, where the same reference numerals will be used for similarelements, wherein:

FIG. 1 is a perspective view schematically illustrating an embodiment ofthe inventive suspended ceiling comprising a plurality of ceiling tilesand a grid of T-profiles.

FIG. 2 is a perspective view illustrating a two side edges and a backsurface of one of the ceiling tiles shown in FIG. 1.

FIG. 3 a is a cross-sectional side view of two ceiling tiles of the typeshown in FIG. 2 along the lines A-A and C-C as mounted into an invertedT-profile.

FIG. 3 b is a cross-sectional side view of two ceiling tiles of the typeshown in FIG. 2 along the lines B-B and D-D as mounted into an invertedT-profile.

FIG. 4 a and FIG. 4 b illustrate cross-sectional side views of analternative embodiment of one of the ceiling tiles shown in FIG. 1 asmounted into a pair of inverted T-profiles.

FIG. 5 is a perspective view illustrating yet an alternative embodimentof one of the ceiling tiles shown in FIG. 1.

FIGS. 6 a-c are cross-sectional side views of the ceiling tile of thetype shown in FIG. 5 along the lines A1-A2, B1-B1 and C1-C1,respectively, as mounted into a pair of inverted T-profiles.

FIG. 7 a-c schematically illustrates an embodiment of a method formounting a suspended ceiling according to the present inventive concept.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1 is a schematic perspective view illustrating an embodiment of theinventive suspended ceiling 100 comprising a plurality of ceiling tiles120, 122 and a grid of profiles 110, 112, as seen obliquely from above.The suspended ceiling 100 is adapted to be mounted underneath a mainceiling of a room or another accommodation, thereby forming atwo-dimensional visible ceiling surface as seen from below. Whenmounted, the grid of profiles 110, 112 comprised in the suspendedceiling 100 is preferably at least partly concealed. In one example, thegrid of profiles 110, 112 is concealed in one direction of the suspendedceiling 100 and exposed in the other direction. In another example, thegrid of profiles 110, 112 is concealed in both directions of thesuspended ceiling 100.

The grid of profiles 110, 112 is a supporting structure for the ceilingtiles 120, 122 and comprises profiles 110, 112 in the form of mainrunners 110 as well as cross runners 112. A first set of main runners110 may be suspended in the main ceiling, thereby supporting the grid ofprofiles 110, 112, while a second set of main runners 110 may benon-supported in the same. Moreover, the first set may extend acrossseveral ceiling tiles 120, 122 while the second set may comprise severalsegments, whereby each segment extends along the adjacent side edges ofone pair of neighbouring ceiling tiles 120, 122. The cross runners 112are provided at right angles to the main runners 110 and are connectedto the same at a discrete set of locations. Thereby, the main runners110 and the cross runners 112 form a grid-like structure which isadapted to support ceiling tiles 120, 122 of a rectangular shape.Optionally, the grid of profiles 110, 112 may also comprise wall runnersas is well-known to a person skilled in the art. It is also understoodthat the overall geometry of the profiles may vary. For instance, theprofiles may be curved, horizontally and/or vertically, and mayconsequently be adapted to support ceiling tiles of other shapes. Forexample, a ceiling tile may be in the shape of a polygon, such as atriangle, a quadrilateral or a pentagon, etc.

According to the present embodiment, the grid of profiles forms framesin the shape of inner rectangular frames and outer rectangular frameportions into which the ceiling tiles 120 and 122 are to be inserted,respectively. Thus, each ceiling tile 120, 122 is at least partlyenclosed by profiles. The inner rectangular frames are adapted tosupport ceiling tiles with lateral dimensions 600 mm×1200 mm, while theouter rectangular portions are adapted to support ceiling tiles havingsmaller lateral dimensions, such as 600 mm×300 mm and 200 mm×300 cm.Naturally, also other lateral dimensions are conceivable. For example, aquadratic ceiling tile may have the dimensions 600 mm×600 mm.

The grid of profiles 110, 112 is suspended by hangers 130 such as hangerwires, rods, etc. In FIG. 1, each hanger 130 comprises a first and asecond hanger element which are arranged in parallel. An end portion ofeach of the first hanger elements is provided with a hook and isinserted into a corresponding hole in a hanger clip which is provided ina main runner 110. Moreover, the length of each hanger 130 is adjustableby means of an arrangement which allows for a relative lengthwisedisplacement of the first and second hanger element. The second hangerelements are fastened to a permanent structure of the room, such as themain ceiling of the room (not shown), thereby upholding the suspendedceiling.

According to the present embodiment, each of the profiles 110, 112 is aninverted T-profile, or a tee, thereby having a cross-section in the formof an inverted T. Thus, each of the profiles has a central web and twoflanges which protrude to an equal extent from a lower part of the webin two opposite horizontal directions. The flanges are adapted tosupport the ceiling tiles 120, 122. Optionally, the central web maycomprise a bulb, e.g. for reinforcing the T-profile. The profiles arecomprised of a light-weight material. For example, the material may be ametal such as steel or a sheet metal. Alternatively, the material may bea rigid plastic, a light metal, such as aluminium, or similarly. Theprofiles 110, 112 according to the present embodiment are rigid.However, it is equally conceivable to utilize resilient profiles 110,112 which may simplify the installation of the ceiling tiles 120, 122.

According to an alternative embodiment, the profiles 110, 112 maycomprise at least one of an L-profile, an H-profile, an I-profile and aZ-profile.

According to the present embodiment, the ceiling tiles 120, 122 arerectangular comprising four sides, wherein each side is adapted toengage with a profile 110, 112. Alternatively, the ceiling tiles 120,122 may have other shapes. As mentioned above, the ceiling tile may forexample be in the shape of a polygon, such as a triangle, aquadrilateral or a pentagon, etc.

The ceiling tiles 120, 122 comprises inner ceiling tiles 120 and outerceiling tiles 122 which are inserted into the inner rectangular framesand outer rectangular frame portions, respectively. The outer ceilingtiles 122 may have smaller dimensions than the inner ceiling tiles 120.Each inner ceiling tile 120 is surrounded by other ceiling tiles 120,122 and is supported by main runners 110 along one opposing pair ofsides. Moreover, each outer ceiling tile 122 is supported by mainrunners 110 along one side and by cross runners 112 along at least oneof the remaining sides. Optionally, at least one side of an outerceiling tile 122 may be supported by a wall runner. In one example, anouter ceiling tile 122 is produced by cutting an inner ceiling tile 120to smaller dimensions so that it fits along a given wall or corner of aroom.

In order to improve the acoustical environment of the room, each of theceiling tiles 120, 122 may comprise a material which is sufficientlyacoustically absorbing and/or acoustically insulating for the room underconsideration. In addition, the materials are preferably chosen to berelatively lightweight, thereby giving rise to a lightweight ceiling.Moreover, the material of the ceiling tiles 120, 122 is preferably anelastically deformable material. For example, the ceiling tiles may bemade of a compressed fibre material comprising mineral wool such as rockwool, or especially glass wool.

The lateral dimensions of each ceiling tile 120, 122 substantiallycorrespond to the lateral dimensions of the inner or outer frame intowhich it is to be inserted. More specifically, the lateral dimensions ofeach ceiling tile 120, 122 substantially correspond to the dimensions aframe formed by the upwardly directed web portions of the T-profilessurrounding the ceiling tile under consideration. Furthermore, thethickness of each ceiling tile 120, 122 is preferably smaller than aheight of the upwardly directed web portions of the surroundingT-profiles, although a different thickness is equally conceivable. Forinstance, the thickness may be 20 mm.

Next, the design of an inner ceiling tile 120 will be described withreference to FIG. 2 and FIGS. 3 a-b.

The ceiling tile 120 comprises a first 200, 202 and a second 204, 206pair of side-edge portions, wherein each pair of side-edge portions arenon-adjacent, viz., in the case of a rectangular ceiling tile 120,oppositely arranged. The first pair of side-edge portions comprises thefirst side edge 200 and the second side edge 202, and the second pair ofside-edge portions comprises the third side edge 204 and the fourth sideedge 206.

Furthermore, the ceiling tile 120 has a front surface 210 and a backsurface 212 which are oppositely arranged to each other. The frontsurface 210 is arranged to be visible from below when the suspendedceiling is mounted.

The first side edge 200 is provided with a first groove 220 whichextends along the entire first side edge 200, extending from a surfaceof the third side edge 204 to a surface of the fourth side edge 206. Thefirst groove 220 is stepped in that it comprises a shallow part 222 anda deep part 224 which are defined by an upper engagement surface 226, aboundary surface 228 and an auxiliary surface 227 which are providedessentially in parallel with respect to either the front surface 210 orthe back surface 212 of the ceiling tile 120. The upper engagementsurface 226 is, as evident from i.e. FIG. 3 a, faced in the samedirection as the front surface 210. A depth of the deep part 224 islarger than a depth of the shallow part 222. Moreover, a width of thefirst groove 220 at the very bottom of the deep part 224 is smaller thana width at the shallow part 222 close to the surface of the side edge200. The width at the very bottom of the deep part 224 is defined by theauxiliary surface 227 and the boundary surface 228, while the width atthe shallow part 222 close to the surface of the side edge 200 isdefined by the upper engagement surface 226 and the boundary surface228. As will be described below, the deep part 224 is adapted to be usedwhen installing the ceiling tile 120 in the grid of profiles 110, 112,whereas the shallow part 222 is adapted to align and lock the ceilingtile 120.

According to the present embodiment, the lower lip 229 is extendingfarther out than upper lip 223 in order to be able to better conceal theT-profile 260 from below. According to an alternative embodiment,however, the upper 229 and lower lip 223 may have an equal extension.

The second side edge 202 is provided with a second groove 230 whichextends along the entire second side edge 202, extending from thesurface of the third side edge 204 to the surface of the fourth sideedge 206. The second groove 230 is also depicted in an adjacent ceilingtile 120 a in FIG. 3 a at 230 a. As opposed to the first groove 220, thesecond groove 230 is not stepped. The second groove 230 is defined bythe upper engagement surface 236, faced in same the direction as thefront surface 210, and the boundary surface 238 such that a width of thesecond groove 230 is substantially constant. In other words, theengagement surface 236 and the boundary surface 238 are providedessentially in parallel with respect to either the front surface 210 orthe back surface 212 of the ceiling tile 120. According to the presentembodiment, the lower lip 234, 234 a is extending farther out than theupper lip 232, 232 a in order to be able to better conceal the T-profile260 from below. According to an alternative embodiment, however, theupper 232, 232 a and lower lip 234, 234 a may have an equal extension.

The upper engagement surfaces 226 and 236, 236 a are arranged at adistance X from the front surface 210, 210 a, see FIG. 2 and FIG. 3 a.Here, the distance from the front surface is measured normal to thefront surface. Indeed, if a horizontal arrangement of the ceiling tile120 is desired, and the flanges of the T-profiles 110, 112 are situatedat the same height, the upper engagement surfaces 226 and 236 of thefirst and the second groove are preferably arranged at the same height.

Moreover, the auxiliary surface 227 is arranged at a distance Z from thefront surface 210, 210 a. The distance Z is preferably less than X.

The width of the first 220 and second 230 groove is preferably equal orlarger than a width of a portion of the T-profile, such as a flange,which is adapted to be inserted into the grooves. According to analternative embodiment, at least one of the second groove and the deeppart of the first groove is tapering, such that the width of the groovein question is smallest at its deepest part. A tapering groove of thiskind may, for instance, allow for a wedging of the ceiling tile,temporarily or permanently.

According to an alternative embodiment, the first groove 220 may betilted with respect to either the front surface 210 or the back surface212 of the ceiling tile 120. More specifically, the upper 226 engagementsurface, the boundary surface 228 as well as the auxiliary surface 227of the first groove may be provided obliquely with respect to either thefront surface 210 or the back surface 212. Preferably, the first groove220 is arranged at an angle which allows for a simple installation ofthe ceiling tile 120 from below.

The third 204 and fourth 206 side edges are provided with a first 240and a second 250 stepped profile, respectively, which extend along theentire third 204 and fourth 206 side edge. Furthermore, each steppedprofile 240, 250 extends from a surface of the first side edge 200 to asurface of the second side edge 202. A cross section of the secondstepped profile 250 is also depicted to the right in FIG. 3 b, andfurthermore a cross section of the first stepped profile 240 provided inan adjacent ceiling tile 120 b is depicted in FIG. 3 b at 240 b. Eachstepped profile 240, 250 forms a step in the back surface 212 of theceiling tile 120. The first stepped profile 240, 240 b comprises anupper wall portion 242, 242 b a lower engagement surface 244, 244 b anda lower wall portion 246, 246 b which is parallel to the upper wallportion 242, 242 b. The lower engagement surface 224 is faced in thesame direction as the back surface 212. The second stepped profile 250comprises an upper wall portion 252, a lower engagement surface 254,faced in the same direction as the back surface 212, and a lower wallportion 256 which is parallel to the upper wall portion 252. A lowerpart of the upper wall portion 242, 242 b, 252 is connected to an upperpart of the lower wall portion 246, 246 b, 256 via the lower,essentially horizontal, engagement surface 244, 244 b, 254.

The lower engagement surfaces 244, 244 b and 254 are arranged at adistance Y from the front surface 210, 210 b, see FIG. 2 and FIG. 3 b.Here, the distance from the front surface is measured normal to thefront surface. The distance Y is at least equal to the distance Xdefined above. Note, however, that in a mounted state, the relationbetween X and Y may be different, since the ceiling tile may becompressed. Thus, in a mounted state, X′ may be less than Y′, where theprimes indicate that the distances are valid when the ceiling tile ismounted, see FIG. 3 a and FIG. 3 b.

It is noted that the auxiliary surface 227, which is arranged at adistance Z from the front surface 210, 210 b as mentioned above, may beless than Y, larger than Y, or equal to Y.

With reference to FIG. 4 a and FIG. 4 b, which illustratecross-sectional side views of an alternative embodiment 300 of one ofthe ceiling tiles shown in FIG. 1, the first 320 as well as the second330 groove may comprise a stepped profile. Each of these grooves 320,330 comprises a shallow part and a deep part in exact analogy with thediscussion above (cf. the first groove 220). The dimensions of the twostepped profiles are preferably the same, but alternatively they maydiffer. For example, the depth of the deep part of the first groove 320may be larger than the depth of the deep part of the second groove. Thefirst 340 and the second 350 stepped profiles provided in the secondpair of side-edge portions are similar to those of the embodimentdiscussed in the above (cf. the stepped profiles 240 and 250), see FIG.4 b. The ceiling tile 300 is mounted into the inverted T-profiles 400,410 and 420, 430 as illustrated in FIG. 4 a and FIG. 4 b, respectively.

In analogy with the discussion above, X′ and Y′ in FIG. 4 a-b are thedistances from the front surface to the upper and the lower engagementsurfaces of the ceiling tile, respectively, in a mounted state.

As is clear from the above, the rightmost parts of FIGS. 3 a and 3 billustrate cross sections of the ceiling tile 120 in FIG. 2 taken alongthe lines A-A and B-B, respectively. Furthermore, the leftmost parts ofFIGS. 3 a and 3 b, illustrate cross sections of ceiling tiles 120 a and120 b adjacent to the ceiling tile 120, corresponding to cross sectionsof the ceiling tile 120 in FIG. 2 taken along the lines C-C and D-D,respectively. In other words, adjacent ceiling tiles 120, 122 comprisedin the suspended ceiling 100 are arranged in the grid of profiles 110,112 as in FIG. 3 a in one direction and as in FIG. 3 b in aperpendicular direction.

More specifically, the T-profiles consist of main runners 110 with crosssection 260 and cross runners 120 with a cross section 270. Needless tosay, the roles of these two types of T-profiles may be interchanged.From the cross-sectional views in FIG. 3 a and FIG. 3 b, it is clearthat the T-profile comprises two flanges 262 and 264, in the case of amain runner 110, and 272 and 274, in the case of a cross runner 120,which flanges extend in opposite horizontal directions. When mounted,the upper engagement surface 226 of the ceiling tile 120 engages with anupper side 266 of the flange 264 of the T-profile 260 while the upperengagement surface 236 a of the adjacent ceiling tile 120 a engages withan upper side 268 of the flange 262 of the T-profile 260. Thus, in amounted state, the upper engagement surfaces 226 and 236 a provided inthe first 220 and second groove 230 a, respectively, are substantiallyaligned, i.e. the surfaces are essentially parallel to each other andsituated at essentially the same vertical spatial height as measuredfrom a reference plane in the room, such as a floor or a main ceiling.Note, however, that the boundary surfaces 228 and 238 a provided in thefirst 220 and second groove 230 a, respectively, do not need to bealigned or situated at the same vertical spatial height.

Furthermore, when mounted, the engagement surface 254 of the ceilingtile 120 engages with an underside 276 of the flange 274 of theT-profile 270 while the engagement surface 244 b of the adjacent ceilingtile 120 b engages with an underside 276 of the flange 272 of theT-profile 270. Thus, in a mounted state, the engagement surface 244 b issubstantially in parallel with the engagement surface 254, see FIG. 3 b.

Consequently, only the front surfaces 210, 210 a, 210 b of the ceilingtiles 120, 120 a, 120 b are visible from below in a mounted state whilethe back surfaces 212, 212 a, 212 b are concealed. The protrusion 247 bof the first stepped profile 240 b and the protrusion 257 of the secondstepped profile 250 may have a gap between them, as in the presentembodiment, thereby exposing parts of the underside 276 of the T-profile270. The gap may have a width of 8 mm, but other widths are equallyconceivable. According to an alternative equally conceivable embodiment,there is no gap between the protrusion 247 b and the protrusion 257,whereby a concealment of the T-profile 270 in the direction along, say,the cross runners 112 is attained.

Notice that in the other direction, along the main runners 110, there ispreferably a distance between the ceiling tiles 120, thereby making thegrid of profiles exposed. More particularly, there is preferably a gapbetween the lower lip 234 a and the lower lip 229 in order to be able tomount the ceiling tile 120 according to the method describe below. Thegap may have a width of 8 mm, but other widths are equally conceivable.Optionally, there may be a concealing element provided in the gapbetween the lower lip 234 a and the lower lip 229, extending in adirection along the main runners 110, arranged to conceal at least apart of the exposed underside of the T-profile 260. For instance, theconcealing element may be a cap. According to another option, there maybe a spacer mounted in the gap which is arranged to interlock theceiling tiles 120, 120 a, thereby preventing them from being displaced.Alternatively, the spacer may be arranged to prevent demounting of theceiling tiles 120, 120 a.

According to an alternative embodiment, there is substantially nodistance, or gap, between the ceiling tiles 120, so that the lower lip234 a and the lower lip 229 are close to or engage with each other.Thus, the extension of at least one of the lower lip 234 a and the lowerlip 229 are adapted accordingly to accomplish this engagement.

In fact, the gap between the ceiling tiles may be avoided by designingthe inventive ceiling tile according to the alternative embodiment asillustrated FIG. 5 and FIG. 6 a-c. FIG. 5 is a perspective view of aceiling tile 500 which may be utilized in order to create a gaplesssuspended ceiling, i.e. a suspended ceiling wherein there are no gapsbetween the ceiling tiles. Moreover, FIGS. 6 a-c illustratecross-sectional side views of the ceiling tile 500 in FIG. 5 along thelines A1-A2, B1-B1 and C1-C1, respectively, as mounted into a pair ofinverted T-profiles.

The ceiling tile 500 is provided with a first 520 and a second 530groove. The first groove 520 is provided with a stepped profilesimilarly to the first groove 220 in FIG. 3 a. However, width of thedeep part of the first groove 520 is larger than that of the firstgroove 220. Moreover, the second groove 530 is similar to the secondgroove 230 a in FIG. 3 a, except that the width of the second groove 530is larger than the corresponding width of the second groove 230 a.According to the present embodiment, the width of the first groove 520is larger than the width of the lower lip 534 so that the lower lip 534is arranged to be inserted into the first groove 520 of an adjacentceiling tile of the same type as the ceiling tile 500 in a mountingprocess. According to yet another embodiment, however, the widths may besubstantially equal so that the lower lip has to be forced into thefirst groove.

Furthermore, the ceiling tile 500 is provided with first 540 a, 540 band second 550 a, 550 b stepped profiles. The first stepped profilecomprises a thick part 540 a and a thin part 540 b, wherein the thinpart 540 b has a smaller width Z than the width Y of the thick part 540a as indicated in FIG. 5. According to the present embodiment, the firststepped profile 540 a, 540 b is thereby stepped also in a lengthwisedirection. In an unmounted state, the distances from the front surfaceto the upper and the lower engagement surfaces of the ceiling tile 500,both labelled by X in FIG. 5, are substantially the same. The distancesX′, Y′, Z′ corresponding to the distances X, Y, Z in a mounted state areindicated in FIGS. 6 a-c.

The second stepped profile 550 a, 550 b is completely analogous to thefirst stepped profile 540 a, 540 b, whereby the remarks presented abovein relation to the first stepped profile 540 a, 540 b are equally validfor the second stepped profile 550 a, 550 b.

Optionally, the ceiling tile 120 may comprise one or several marks, e.g.in the form of small kerfs or chamferings provided in the front surface210 for indicating areas in which forces are to be applied whendemounting the ceiling tile 120. The marks may be substantiallyinvisible from a large distance.

According to an alternative embodiment, the ceiling tile 120 furthercomprises external units. An external unit may be a lighting fixture, adevice related to heating, ventilation or air condition, etc. Forexample, the external unit may be located at a center point of the frontsurface 210 of the ceiling tile 120. Thus, according to this embodiment,there is provided an external unit integrated with the ceiling tile 120which is easily mountable in the suspended ceiling 100. Additionally,the external unit may be easily accessible from the back surface 212since the inventive ceiling tile 120 in which the external unit isprovided is easily demountable.

Next, an embodiment of a method for mounting a suspended ceiling 100will be described with reference to the cross-sectional views in FIG. 7a-c. According to the method, a ceiling tile 120 is mounted in a grid ofprofiles which comprises the inverted T-profiles 260 and 280. Theinstallation of other ceiling tiles 120, 122 in the suspended ceiling100, comprising the grid of profiles 110, 112, proceeds analogously.

The inverted T-profiles 260 and 280 comprise a central web 261 and 281,and two opposing flanges 262, 264 and 282, 284, respectively. TheT-profiles 260 and 280 are separated by a horizontal distance and aresituated at the same height from a floor of the room in which thesuspended ceiling 100 is to be mounted. In the present embodiment, adistance between the rightmost end of the flange 264 of the T-profile260 and the leftmost end of the flange 282 of the T-profile 280 issmaller than the width of the ceiling tile 120, extending from the first200 and second 202 side edges, so that the ceiling tile 120 needs to beinclined in order be able to mount it between the T-profiles 260, 280.

Indeed, in FIG. 7 a the rightmost part of the ceiling tile 120 isinclined downwards while the leftmost part is directed towards theflange 264. It is understood that the entire side edge 202 is inclined.The ceiling tile 120 is inclined with respect to a plane substantiallyin parallel with a plane defined by the grid of profiles. Thereafter,while the ceiling tile continues to be inclined, the flange 264 isinserted into the deep part 224 of the groove 220 so that the auxiliarysurface 227 engages with the upper side 266 of the flange 264.Optionally, the boundary surface 228 may engage with the lower side 267of the flange 264. The insertion of the flange 264 into the groove 220continues until the side edge 202 at the rightmost part of the ceilingtile 120 in FIG. 7 a clears the flange 282. By clearing is here meantthat the side edge 202 may be freely pivoted without touching the flange282, while the flange 264 is inserted into the groove 220. In somecircumstances, the flange 264 may have to be forced into the groove 220for clearing the flange 282.

Next, the side edge 202 is tilted upwards into a horizontal position,while the flange 264 is continuing to be inserted into the groove 220,so that the second groove 230 is aligned with the flange 282, see FIG. 7b. At this point, the first 240 and second 250 stepped profiles (notshown in FIGS. 4 a-c) arranged along the third and fourth side edges,respectively, engage with a respective flange as described in the above,cf. the stepped profiles 240 b and 250 in FIG. 3 b. More specifically,the lower engagement surfaces 244 and 254 of the stepped profiles 240and 250 engage with a third and a fourth flange which are arranged onT-profiles which extend perpendicularly to the T-profiles 260, 280, suchas the T-profile 270 in FIG. 3 b.

In the following, reference is made to the quantities X and Y definedabove for the ceiling tile 120. Namely, if the distance Y is larger thanthe distance X, the lower engagement surfaces 244, 254 have to becompressed against the underside 276 of the third and fourth flanges inorder be able to align the second groove 230 with the flange 282. On theother hand, if the distance Y is essentially equal to the distance X, nosubstantial compression of the lower engagement surfaces 244 is needed,since then the lower 244 and upper 226 engagement surfaces will besituated at the same level. After compression, the distances X and Y mayhave been modified into the distances X′ and Y′ which may have adifferent relation than X and Y.

Optionally, the upper lip 232 of the ceiling tile 120 may have to beforced past the flange 282 into the horizontal position in order toalign the second groove 230 with the flange 282.

Finally, while continuing engagement between the first 240 and second250 stepped profiles and the third and fourth flanges, the ceiling tile120 is displaced towards the flange 282 so that the flange 282 isinserted into the groove 230, whereby the upper engagement surface 236engages with the upper side 286 of the flange 282. Optionally, theboundary surface 238 may engage with a lower side 287 of the flange 282.The insertion of the flange 282 into the groove 230 continues until theflange 264 at the leftmost part of the ceiling tile 120 in FIG. 7 c isreleased from the engagement with the auxiliary surface 227 and insteadengages with the upper engagement surface 226. Put differently, as aresult of the horizontal displacement, the ceiling tile 120 clicks downa step from the deep part 224 to the shallow part 222 of the groove 220into a position in which the front surface 210 is substantially parallelwith the main ceiling or floor of the room. In this position, lateraldisplacements of the ceiling tile 120 are prevented due to the presenceof the grooves 220, 230 as well as the clamping action between theprofiles and the four side edges 200, 202, 204, 206, as described in theabove.

The ceiling tile 300 in FIG. 4 a-b may be mounted in a similar manner asthe ceiling tile 120, whereby reference is made to the above. However,by means of the stepped profiles provided in the first 320 as well asthe second 330 groove, either the first side edge or the second sideedge may be directed towards a first flange into which the ceiling tile300 is to be inserted.

Moreover, in the mounting process of the ceiling tile 300, it has toclick down a step from the deep part to the shallow part in the firstgroove 320 as well as in the second groove 330 in order to a enter aposition in which the front surface of the ceiling tile is substantiallyparallel with the main ceiling or floor of the room.

The ceiling tile 500 displayed in FIG. 5 and FIGS. 6 a-c may be mountedin a similar manner as the ceiling tile 120 described above. Inparticular, a plurality of ceiling tiles of the type 500 shown in FIG. 5and FIGS. 6 a-c may be mounted one after another, starting with the sidecomprising the lower lip 529 and the first groove 520. However, by meansof the widths of the first 520 and the second 530 groove being largerthan the corresponding widths of the ceiling tile 120, as well as thestepped profiles 540 a-b, 550 a-b being stepped also in a lengthwisedirection, a gapless mounting of the ceiling tile 500 is admitted whilesimultaneously allowing for an improved demounting process of theceiling tile 500.

Indeed, in a suspended ceiling comprising a lattice of ceiling tiles 500of the type shown in FIG. 5 and FIGS. 6 a-c, any of these ceiling tiles500 may be demounted without the need of demounting any of the adjacentceiling tiles. More specifically, a ceiling tile 500 mounted intoinverted T-profiles 600, 610, 620, 630 as in FIG. 6 a-c may be demountedas follows. First, the lower lip 529 is moved vertically in an upwarddirection, which is possible due to the thin part 540 b, 550 b of thesecond stepped profile. Then, the ceiling tile 500 is moved horizontallyto the right by inserting the its lower lip 529 into the second groove(cf. 530) of the adjacent ceiling tile which is of the same type as theceiling tile 500. The horizontal displacement proceeds until the upperlip 532 clears the rightmost flange of the T-profile 600. In thisposition, the leftmost part of the ceiling tile 500 may be displaceddownwards, thereby disengaging the thick parts 540 a, 550 a of the firststepped profiles, and may consequently be completely removed from thegrid of profiles 600, 610, 620, 630. A mounting of the ceiling tile 500proceeds analogously to the demounting just described, albeit in areverse order.

The invention has mainly been described above with reference to a fewembodiments. However, as is readily appreciated by a person skilled inthe art, other embodiments than the ones disclosed above are equallypossible within the scope of the invention, as defined by the appendedpatent claims. For example, it is noted that even though the presentinventive concept has been described in relation to a flat suspendedceiling which is substantially in parallel with either a main ceiling ora floor of a room, it is equally applicable to inclined suspendedceilings which form an angle with the main ceiling or the floor.

1. A suspended ceiling (100) comprising a ceiling tile (120; 122; 120 a;120 b; 300; 500) and a grid of profiles (110; 112) forming a frame whichsupports said ceiling tile (120; 122; 120 a; 120 b; 300; 500), saidceiling tile (120; 122; 120 a; 120 b; 300; 500) having a first (200;202) and a second (204; 206) pair of non-adjacent side-edge portions,characterized in that said grid of profiles (110; 112) engages frombelow with the first pair of side-edge portions (200; 202), and saidgrid of profiles (110; 112) engages from above with the second pair ofside-edge portions (204; 206), wherein said grid of profiles (110; 112)engages with said first (200; 202) and second (204; 206) pair ofside-edge portions such that a clamping action that counteracts lateraldisplacement of the ceiling tile (120; 122; 120 a; 120 b; 300; 500) isprovided.
 2. The suspended ceiling (100) according to claim 1, in whichsaid grid of profiles (110; 112) engages with said first (200; 202) andsecond (204; 206) pair of side-edge portions under elastical deformationof the latter.
 3. The suspended ceiling (100) according to claim 1 or 2,in which said first pair of side-edge portions (200; 202) comprises afirst side edge (200) and a second (202) side edge, wherein a firstgroove (220; 320; 520) is provided in and extending along the first sideedge (200), and wherein a second groove (230; 330; 530) is provided inand extending along the second side edge (202), a depth of said firstgroove (220; 320; 520) being larger than a depth of said second groove(230; 330; 530), said grid of profiles (110; 112) comprising a first anda second flange (262; 264; 272; 274; 282) received by said first (220;320; 520) and second (230; 330; 530) grooves, respectively.
 4. Thesuspended ceiling (100) according to claim 3, wherein the engagementbetween said grid of profiles (110; 112) and the first pair of side-edgeportions (200; 202) occurs between said first and second flange (262;264; 272; 274; 282) and an upper engagement surface (226; 236; 236 a)associated with said first (220; 320; 520) and second (230; 330; 530)groove, respectively.
 5. The suspended ceiling (100) according to claim4, wherein said upper engagement surface (226) of said first groove(220; 320; 520) is stepped.
 6. The suspended ceiling (100) according toany of the preceding claims, in which said second pair of side-edgeportions (204; 206) comprises a third side edge (204) and a fourth sideedge (206), wherein a first stepped profile (240; 240 b; 340; 540 a-b)is provided in and extending along the third side edge (204) for forminga step in a back surface (212; 212 b) of said ceiling tile (120; 122;120 a; 120 b; 300; 500), and wherein a second stepped profile (250; 350;550 a-b) is provided in and extending along the fourth side edge (206)for forming a step in said back surface (212; 212 b), said grid ofprofiles (110; 112) comprising a third and a fourth flange engaging withsaid first (240; 240 b; 340; 540 a-b) and second (250; 350; 550 a-b)stepped profiles, respectively.
 7. The suspended ceiling (100) accordingto claim 6, wherein the engagement between said grid of profiles (110;112) and the second pair of side-edge portions (204; 206) occurs betweensaid third and fourth flange and a lower engagement surface (244; 244 b;254) associated with said first (240; 240 b; 340; 540 a-b) and second(250; 350; 550 a-b) stepped profile, respectively.
 8. The suspendedceiling (100) according to any of the preceding claims, wherein saidceiling tile (120; 122; 120 a; 120 b; 300; 500) is rectangular.
 9. Thesuspended ceiling (100) according to any of the preceding claims,wherein said ceiling tile (120; 122; 120 a; 120 b; 300; 500) comprisescompressed fibre material.
 10. A suspended ceiling (100), furthercomprising a plurality of ceiling tiles (120; 122; 120 a; 120 b; 300;500) according to any of the preceding claims.
 11. A method for mountinga suspended ceiling (100), comprising providing a grid of profiles (110;112) and a ceiling tile (120; 122; 120 a; 120 b; 300; 500), installingthe ceiling tile (120; 122; 120 a; 120 b; 300; 500) in a frame of saidgrid of profiles (110; 112), said ceiling tile having a first (200; 202)and a second (204; 206) pair of non-adjacent side-edge portions, whereininstalling said ceiling tile (120; 122; 120 a; 120 b; 300; 500),characterized in arranging the ceiling tile (120; 122; 120 a; 120 b;300; 500) in an inclined position and directing a first side edge (200)of the first pair of side-edge portions (200; 202) towards a firstflange of the frame; inserting, by relative displacement of the ceilingtile (120; 122; 120 a; 120 b; 300; 500) and the grid of profiles (110;112), said first flange into a first groove (220; 320; 520) of saidceiling tile (120; 122; 120 a; 120 b; 300; 500) provided along saidfirst side edge (200) to such an extent that a second side edge (202) ofthe first pair of side-edge portions (200; 202) clears a second flangeof the frame, whereby said first flange engages from below with an upperengagement surface (226) associated with the first groove (220; 320;520); arranging the ceiling tile (120; 122; 120 a; 120 b; 300; 500) in ahorizontal position and aligning a second groove (230; 330; 530) of saidceiling tile (120; 122; 120 a; 120 b; 300; 500) provided along saidsecond side edge (202) with said second flange, such that a third and afourth flange of said frame engage from above with a third (204) and afourth (206) side edge, respectively, of the second pair of side-edgeportions (204; 206), the first flange continuing to engage from belowwith said upper engagement surface (226) associated with the firstgroove (220; 320; 520); and displacing the ceiling tile (120; 122; 120a; 120 b; 300; 500) towards the second flange, the first, third andfourth flange continuing to engage with the first (200), third (204) andfourth (206) side edge, respectively, such that said second flangeengages from below with an upper engagement surface (236; 236 a)associated with the second groove, whereby said flanges engages withsaid side-edge portions (200; 202; 204; 206) such that a clamping actionthat counteracts lateral displacement of the ceiling tile (120; 122; 120a; 120 b; 300; 500) is provided.
 12. The method according to claim 11,wherein the act of providing a ceiling tile further comprises providinga ceiling tile (120; 122; 120 a; 120 b; 300; 500) in which said upperengagement surface (226) of said first groove (220; 320; 520) isstepped.
 13. The method according to claim 11 or 12, wherein a firststepped profile (240; 240 b; 340; 540 a-b) is provided in and extendingalong the third side edge (204) for forming a step in a back surface(212; 212 b) of said ceiling tile (120; 122; 120 a; 120 b; 300; 500),and wherein a second stepped profile (250; 350; 550 a-b) is provided inand extending along the fourth side edge (206) for forming a step insaid back surface (212; 212 b), said third and fourth flanges comprisedin the grid of profiles (110; 112) engaging with said first (240; 240 b;340; 540 a-b) and second (250; 350; 550 a-b) stepped profiles,respectively.
 14. The method according to claim 11, 12 or 13, whereinsaid grid of profiles (110; 112) engages with said first (200; 202) andsecond pair of side-edge portions (204; 206) under elastical deformationof the latter.
 15. A ceiling tile for a suspended ceiling (100), theceiling tile (120; 122; 120 a; 120 b; 300; 500) being arranged to besupported by flanges (262; 264; 272; 274; 282) of a grid of profiles(110; 112), said flanges (262; 264; 272; 274; 282) having a thickness T,wherein said ceiling tile (120; 122; 120 a; 120 b; 300; 500) having afront surface (210; 210 b), a back surface (212; 212 b) and a first(200; 202) and a second (204; 206) pair of non-adjacent side-edgeportions, characterized in that each side-edge portion of said firstpair (200; 202) comprising an upper engagement surface (226; 236; 236 a)faced in the same direction as the front surface (210; 210 b) and eachside-edge portion of said second pair (204; 206) comprising a lowerengagement surface (244; 244 b; 254) faced in the same direction as theback surface (212; 212 b), wherein said upper engagement surfaces (226;236; 236 a) being arranged at a distance (X) from said front surface(210; 210 b), said lower engagement surfaces (244; 244 b; 254) beingarranged at a distance (Y) from said front surface (210; 210 b), whereinthe difference between said distance X and said distance Y is less thansaid thickness T.